EZINE:
In this week's Computer Weekly, we examine the implications of the controversial acquisition of UK chip leader Arm by US rival Nvidia. Black Lives Matter has raised awareness of social inequalities, but is the tech sector becoming more diverse? And we ask if business software can learn from the addictive nature of social apps. Read the issue now.
WHITE PAPER:
This study details the performance scalability of the Cisco unified computing system (UCS) platform coupled with Intel Xeon 5600 series processors and EMC CLARiiON storage, and demonstrates why it's a great fit for virtualized SAP solutions.
PRODUCT OVERVIEW:
This solution brief explains how organizations can meet new demands for higher performance, security, reliability, and service levels. Gain insight into a processor-based architecture that will allow you to achieve this goal.
WHITE PAPER:
This resource demonstrates how Carestream Health created a powerful, scalable data center platform able to accommodate more users without sacrificing service quality. Learn how they improved processing power, allowing them to meet the challenges of serving more users while handling more data-intensive workloads.
WHITE PAPER:
Read this white paper to learn how Oracle’s SPARC T4 servers deliver new levels of end-to-end data center performance never before seen in the T-Series line of servers.
WHITE PAPER:
As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with servers that deliver more performance and scalability, more efficiently. Read on to learn more.
WHITE PAPER:
For customers running Sybase ASE 12.5 on Solaris 8, the long-planned end of support for that platform means that they must move their workloads to a new environment or face special support contracts. Moving to HP infrastructure brings immediate payback through lower support costs and reduction in power and cooling requirements.